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https://www.linkedin.com/jobs/view/laser-diode-opto-mechanical-packaging-engineer-at-bluglass-limited-asx-blg-3719126424

Laser Diode Opto-Mechanical Packaging Engineer

BluGlass Limited (ASX: BLG) Greater Boston

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BluGlass Limited (ASX: BLG) provided pay range

This range is provided by BluGlass Limited (ASX: BLG). Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.

Base pay range

$155,000.00/yr - $180,000.00/yr

Additional compensation types

Annual Bonus and Stock options

Direct message the job poster from BluGlass Limited (ASX: BLG)

Brad Siskavich

Brad Siskavich

Sales & Business Development, High Tech Entrepreneurship

Company Description

BluGlass, Inc., based in Nashua, NH, is a wholly-owned subsidiary of BluGlass Limited (ASX: BLG), a global leader in commercializing breakthrough technology using Remote Plasma Chemical Vapor Deposition (RPCVD) for the manufacture of high-performance Laser Diodes and other devices for the Industrial, Biomedical, Scientific, Display (AR/VR/MR) and Defense Markets.. The company has invented a new process using RPCVD to grow advanced materials such as gallium nitride (GaN) and indium gallium nitride (InGaN), which are crucial to the production of high-efficiency devices such as UV and Visible Laser Diodes. BluGlass' breakthrough technology offers many potential benefits over existing technologies, including higher efficiency, lower cost, and new and unique form factors. The company is committed to fostering a creative and empowered workplace culture, and is an equal opportunity employer.

Role Description

This is a full-time, on-site role for a Laser Diode Opto-Mechanical Packaging Engineer, located in Nashua, NH. The Laser Diode Opto-Mechanical Packaging Engineer will be responsible for designing, developing, and optimizing packaging solutions for high-performance laser diodes, while collaborating with cross-functional teams to deliver innovative products and solutions. The Laser Diode Opto-Mechanical Packaging Engineer will also support the development of new platforms and technologies to enhance the company's products, services, and processes.

Principal Areas/Function

Develop and maintain die bonding efforts establishing statistical process control and continuous yield and performance improvement efforts.

▪ Develop and maintain CoS bonding efforts, identifying and implementing hierarchical soldering solutions.

▪ Develop and maintain FAC and SAC lens placement and fiber coupling efforts.

▪ Support failure analysis (FA) processes as needed to determine root cause using internal resources or external vendors.

▪ Provide feedback for device design evolution.

▪ Support efforts to establish burn-in criteria, as well as HAST, HALT qualification processes, and muti-cell reliability protocols supporting product development, product qualification, and production screening.

▪ Analyze the laser device performance throughout development and reliability testing. Apply materials and physics understanding to correlate any performance drifts with design and process inputs.

▪ Collaborate with and learn from device design engineers and technical program managers (PMs) on new products from the initial concept through release to manufacturing.

▪ Work with the Reliability and FA Engineer to develop, execute, and improve BluGlass qualification plans, internal infrastructure as well as external contract manufacturers (CMs).

▪ Collaborate with test engineers and technicians to execute functional testing for each product. Tests include laser current-power-voltage, spectra/junction temperature measurements, near and far field measurements, etc.

▪ Collaborate on the qualification reporting in the form of email updates, customer-facing presentations, internal NPI reviews, and documented qualification reports.

▪ Define key technical objectives and manage projects through the various development phases (feasibility, alpha [design and development], beta [reliability and qualification]) and into production to meet program milestones and product reliability requirements.

▪ Collaborate with testing and reliability groups and participate in the design and setup of new test systems needed to measure laser diode performance

Technical Program/Skills

Maintain knowledge of state-of-the-art principles for advancing the packaging related performance of laser diodes.

▪ Monitor Laser Diode performance in development and production

▪ Establish, monitor, analyze, and report key performance metrics to project teams and management.

▪ Participate in the development of Patent Applications.

▪ Collaborate to publish & present BLG results at Industry Events & Trade shows.

▪ Participate in program reporting, proposal writing, and program management for commercial and government programs.

Qualifications

• Bachelor's degree or higher in Mechanical Engineering, Electrical Engineering, or a related field
• Minimum of 3 years of experience in opto-mechanical packaging, and experience with laser diodes and photonics packaging
• Experience with SolidWorks, AutoCAD, and other CAD tools
• Experience with thermal management and material science, and knowledge of semiconductor device physics and fabrication processes
• Knowledge of industry standards and regulations related to laser diode packaging, safety, and reliability
• Excellent analytical, problem-solving, and project management skills
• Ability to work collaboratively in a fast-paced, highly innovative environment
• Excellent communication skills and ability to present ideas and concepts effectively to both technical and non-technical audiences
• Experience with semiconductor testing, wafer probing, and reliability testing is a plus
• Experience with quality management systems (ISO 9001) and Six Sigma methodologies is a plus