If you want to pilot wafers, do you need to build a Fab like Tower Jazz? or a Fab like TSMC. No, of couse not. It is a way what semiconductor do. It is a way what Nvida, AMD, Apple do. They only do design. The manufacture all rely on semiconductor supply chain in Taiwam.
If you want to package a MEMS device, do you need to build a package Fab to package it? When their is a solution from other source, and it is a quicker and cost effective. Taiwan has a established MEMS packave production chain.
Then, tell me why EM delay for three years, and not a working package shown till now. If EM is so good.
Isreal only has a Fab Tower Jazz. No MEMS package house. AP should try to find a quicker way to package it and verify. Not wast time to build a package house, which never keep their words.
(20min delay)