Caredes, many thanks for posting that link. For those concerned...

Caredes, many thanks for posting that link. For those concerned about delays, and I am one of them, this filing certainly highlights the challenges both AKP and EM have faced developing a manufacturing process for the MEMS which is both repeatable and efficient. The number of additional steps in the process now required to eliminate the warping of the wafer is illustrative of the high degree of difficulty.
Once again thanks for your diligence tracking and posting these IP updates. The end of this stage of the development cycle is definately close now.