I believe the recent patent re multi-level (stackable) memory and the process of doing it is terribly underrated - James Tour said this is what would knock the industry off its feet!!! Anyone care to elaborate?
Then we see Intel team up with Leti to do what?
France's Leti research institute (Grenoble, France) has started collaborating with Intel on 3D chip packaging for processors.The research will focus on the assembly of smaller 'chiplets', the optimization of interconnect and on bonding and stacking technologies for 3D ICs, Leti said. The team work will particularly target high performance computing (HPC) applications.
''Every electronic device in the world is our target'' CEO Coby, page-9
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