SAN LUIS OBISPO, Calif.,Jan. 16, 2024/PRNewswire/ — Revasum Inc, a global leader in semiconductor manufacturing equipment, andAsahi Diamond America, Inc, a renowned provider of diamond and cubic boron nitride tools, are pleased to announce their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding.
The collaboration centers around the utilization of Revasum’s industry-leading 7AF-HMG Silicon Carbide Grinder, a cutting-edge solution specifically designed for the unique challenges posed by 150mm and 200mm silicon carbide wafers. This collaboration brings together Revasum’s expertise in semiconductor grinding andAsahi Diamond America’scutting-edge abrasive technology, marking a significant step forward in silicon carbide wafer manufacturing.
The 7AF-HMG is distinguished by its hard material optimized grind engine that quickly and precisely thins and planarizes 150mm and 200mm silicon carbide wafers. Its advanced features and precision make it a game changer in the industry, ensuring highly efficient and productive processing of bare substrates and device wafers at customer facilities.
Scott Jewler, CEO of Revasum Inc, expressed his enthusiasm stating, “Our work withAsahi Diamond Americais a testament to our commitment to innovation and excellence in semiconductor manufacturing. The 7AF-HMG Silicon Carbide Grinder is a groundbreaking solution that addresses the unique challenges of silicon carbide wafers, and this cooperation will propel the industry forward by improving efficiency and performance.”
Koichi “Ken” Kikuchi, President ofAsahi Diamond America, Inc, echoed this sentiment, saying, “Asahi Diamond Americais thrilled to collaborate with Revasum Inc to elevate silicon carbide wafer grinding to new heights. Our cutting-edge grind wheels combined with Revasum’s advanced tools will empower semiconductor manufacturers to achieve unprecedented precision and efficiency in silicon carbide wafer processing.”
(20min delay)