https://tech.nikkeibp.co.jp/dm/atclen/news_en/15mk/070502951/
http://24-m.com/pressrelease/
The 24M SemiSolid manufacturing platform delivers a significant structural bill of materials advantage and requires substantially less upfront capital. Using electrolyte as the processing solvent in a binderless system, the SemiSolid platform allows for production of electrodes 4-5 times thicker than a conventional process. The use of thick electrodes significantly reduces inactive materials content – copper, aluminum and separator – yielding substantial cost savings.
Good News & Bad News, page-82
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