"The 3D X-Point Memory die measures 206.5 mm2 with a 16.16 mm length and a 12.78 mm width. Memory efficiency in the die is 91.4% which is higher than the Samsung 3D 48L V-NAND (70.0%) and the Intel/Micron 3D FG NAND (84.9%). Memory density of the 3D Xpoint Memory is 0.62 Gb/mm2 which is lower than commercial 2D and 3D NAND products (2.5 Gb/mm2 for Toshiba/SanDisk and Samsung 3D 48L TLC NAND, and 1.28 Gb/mm2 for Toshiba/SanDisk 2D 15nm TLC NAND)."
I am trying to understand the actual difference between memory efficiency and memory density. I think the only difference is memory efficiency means more memory than ICs and logic processors to access and control the memory and memory density is literally how much memory the device actually holds on the die in the given area.
I think, i had an all night bender so my mind is loose as a gooose..
"The 3D X-Point Memory die measures 206.5 mm2 with a 16.16 mm...
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