Hey John,
'Tie in' work as such would all have been completed long ago. The only slow downs would be product diversion ie. 65%/68%. They would be switching between the circuits, they would probably be running parts of the circuit up to full bore and then switching across to the next identical unit until they get it to full bore and then bringing 2/3 units online and seeing how that goes. It would be a slow progression until you get everything tested at nameplate and then you crank everything on at below nameplate to test the whole circuit live and then build to 100%+. That's how I would be doing it anyways. Initial commissioning would get everything wet first and make sure you have no manufacturing/fabrication flaws then run it up.
The 65% stuff should be well sorted/known already with known issues solved/being solved. The 68% part of the circuit has to undergo the same process as the 65% part (which took from April) and then the full integration to complete the overall commissioning. Anyways, I am personally not expecting an announcement until October/November and will be pleasantly surprised if it is earlier.
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Hey John,'Tie in' work as such would all have been completed...
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