Running discussion on SP, page-11907

  1. 1,608 Posts.
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    Well here's my take on the colour scheme on where we are in regards to signing or discussions with the above. Onsemi & DB Hitek are in the bag, then followed by Bosch in the late stages of discussions and/or negotiating a deal. Then followed by Mid point discussions with (In this order) Winbond, Microchip and then XMC. Finishing early discussions in this order are Intel, Texas Instruments, NXP & STMicroelectronics. Early discussions Hua Hong Group. Still in discussions with Global Foundries. Next ones to be approached or have approached us are Tower, Denso, Nexchip, Sony, PSMC followed by Samsung, UMC, Infineon, VIS, Analog Devices, SMIC, Renasas.
 
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