Weebit - 2021and beyond, page-8986

Cool - I’ll be ready to buy yours.

The link from Stony to that 2019 DARPA presentation is incredible:

- ReRam features as the key memory within a 3DSoC
- Skywater working to commercialise CNFET approach that is BEOL compatible (as is our ReRam)
- Skywater has experience already in the “Lab to Fab“ transfer process
- Leti was the research partner assisting the folks at Stanford on the ReRam development

Looks like Leti would have said something like “guys, you’ve been doing all this work to build up a working 3DSoC with new ReRam, so why don’t you work with out WBT where we have advanced ReRam to a commercial level”.

At the 25 minute mark the presenter goes on to state that they already have the design infrastructure that clients can use to tape-out their own customised 3D monolithic chip.

I would guess that the WBT chip has accelerated the ReRam component of this 3D monolithic chip and that Skywater leapt at the chance to incorporate our memory in to this development.