some things to keep in mind about the next few months and what may eventuate ...
$$$$$$
I’ve resolved that we won’t see the
sub system register integration demonstration of the Reram till Q1 2022 and we will possibly see a CR at that point….
This is now the most likely time line for the demonstration which I was hoping might have occurred in 2021…..still, that’s just me wishing for things
Why are these 2 events
highly anticipated and why will they kick the SP to +$6 ?DP and CH have gone to great lengths in the recent ‘meet the chair’ webinars to detail the way forward now that the closed triangle has been broken and we have a Tier 2 fab partner heading to mass production and dedicating a fab line specifically to that end.
That way forward is to devleope the ‘soft touch’ customer access experience where the SoC can be in essence picked ‘off the shelf’ in a ready to integrate format.
The implications for that to occur requires an integration model developed and built around the IP blocks enabling the SoC assembly scrips to operate autonomously and at high level capacity/ delivery.
This is the network structure being constructed and the techniques developed by WBT / CEA Leti will be another first in the industry around SiOx Reram. These network techniques are designed to ensure maximum power conservation, increased data capacity operability, rapid process verification with minimal to no downtime / system impact.
This allows the SoC to partition / isolate ‘on the run’ if you will without the system being impacted.
This network on a chip development / integration is key now – it allows WBT Reram market entry at a level
that is yet to exist…another industry first if you will...all the network specialist houses are working toward this exact pathway in current formats for customer designs – very few are rendering system networks to be available ‘off the shelf’ as WBT/CEA Leti are with a revolutionaly cheapest cost per it product.
It really highlights that as there will be further fab deals struck, the company must prepare the next commercialisation step in parallel…..seems like this will tie in beautifully with the qualification process completion with WBT/ Skywater hitting mass production of the chip.
So the sub system register demonstration is the culmination of this process. As CH / DP mentioned this demonstration is imminent….it indicates that the above network integration has already been prototyped and is operational….this is huge as it
indicates we are at the front of the industry in this space ..SoC/ NoC ( network on achip) will be required by a market sector already demanding this technology toreduce costs and install resilient and reliable
space savingsystems intheir products….increased dollar ROI for WBT/ Skywater/CEA Leti
That bullet point highlighted in the Q2 release is just an amazing development that gets lost in that release but I hope I’ve highlighted the implications in ROI once this demonstration takes place.
Why a CR?
Network engineers will be required on a production scale based on the customer orders that will placed to meet the demand….they are in high demand now and that recruitment void is widening as the industry ramps to meet this customer demand.
Can't think of a better reason to CR - imo....some will scream at the prospect but the SP will more than realise exponential return on new desk capital and ensure ever improving financials.....
exciting times ahead
GLA
(20min delay)