from your list:
1. SKYT qualification
2. Sign Tier-1 fab
3. Close initial customer agreements
4. Qualify tech for auto
5. Continued R&D
6. Continue scaling 22nm
I believe 2 & 3 are probably agreed & ready for signatures as soon as no. 1 is completed.
I must say I am a bit surprised that no. 1 hasn't happened yet given my understanding is that it was purely time based (ie how long the chips had to be baked at high temperatures to mimic normal10 year life span) so they would have known timespan when it was advised.
Weebit - 2023 and beyond, page-1550
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