Just to add a bit more Kadej123, I presuming one of the main reasons that WBT are confident is that so much of the design & testing has already been done on the 40nm module using circuit simulation analysis software.
So they would have used the real world results of the 300nm module ( & 1kb array) to compare with the 300nm simulated results. That would help to determine the acuracy of the 40nm module simulated analysis
Simulated circuit analysis software has been around for a long time, so you can imagine the software Leti is using is most likely the most reliable & comprehensive you can get.
I guess it's something like -
http://www.leti-cea.com/cea-tech/le...ies/integrated-circuits-design-plateform.aspx
and/or
http://www.leti-cea.com/cea-tech/le...Facilities/12in-nanoelectronics-platform.aspx
But if the unthinkable happened & say no module was produced by next Feb, then even if the SP was kaput, they would still have funds for another 12 months or so to get it right.
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