Whats the chance?, page-143

Have you not been following the announcements? I suggest you read them again more carefully.

"... As detailed previously, the company had successfully produced and commenced demonstrations of both individual and multi-chip systems to a number of potential customers that maintain some relevant expertise in Israel. ..."

Note the past tense:-
"... had successfully produced and demonstrat(ed) ... individual and multi-chip systems ... to a number of potential customers ..."

How do you do this without having finished chips? Show them a video of a simulated chip? So what do you think they are using to demonstrate the chips performance to those first important prospective clients? Have they been telling the prospects to just imagine that sound comes from a real finished product, not this fancy piece of equipment that could hide half an orchestra inside it?

The systems that were demonstrated have been described as "engineering versions" or "pre-production versions". We know that the company has produced batches of wafers, presumably in lots of 24 wafers at a time, and have taken these right through to final packaging using a local packaging vendor. That represents a lot of chips. These manually processed engineering stage chips have been said to have been used to produce the demo systems above, and to produce the performance stats that have been announced.

"... Such an “adjustment” poses significant challenges as it essentially necessitates accelerating production and product commercialization activities (as well as the procurement of capital needed to support such activities). It demands the production of many more devices and systems, as well as the adequate “maturing” of the technology, so that it befittingly and securely can be evaluated independently, at customer sites.

While many such commercialization activities were already underway, our demonstration systems were originally designed to be operated by our engineers and systems.

Pivoting from this approach necessitates expediting a wide range of interdependent and third-party reliant activities, including (but by no means limited to):
- Finalization of product optimization for mass production
- Transitioning MEMS manufacturing and packaging from engineering lines to mass-production lines
- Translation and compilation of source code to embedded firmware, as well as the inclusion of encryption and other IP safeguard methods
- Development and fabrication of independently operated demonstration systems and tools
- Production of self-guiding customer oriented materials (such as reference design kits, functional and application guidelines, operating instructions, and so on.
- An urgent need to bring negotiations to conclusion as to secure both short and long term qualitative and quantitative mass-production requirements in comprehensive signed agreements...."

Yes it could be that slightly better versions of the MEMS and ASIC are still being finalised, probably even as we speak, ready to be turned into finished chips. But that does not mean that the engineering chips are either no good or just lucky one-offs. What is being demonstrated is effectively what will be sold, just as a pre-mass-production version.

It is easy to say that in your opinion this is true or not. But why should anyone give any credence to your opinion, or to anybody else's, without your having - and citing - any authoritative basis to justify or even remotely substantiate such an opinion. This is especially important when we have actual announced development milestones showing a clear point of where the company's progress in the process is.

And doubly so when the announced progress you do not believe they have made is on the page staring at us. You might note that the graph shows that the chip delivering 70dB is the current production chip, not a simulation of such a thing. And this is described as being an improvement on the earlier alpha and beta versions shown and described.




2019-Q4 - High density 1K array, commercial process

• Sound from full structure array.

• First tests of simplified structure.

  2020 – High Quality Sound

• Music playback – simplified structure.

• Demonstrated low frequencies (down to 100Hz) and sound quality.

• SPL <50dB @ 1m (SPL= Sound Pressure Level – “loudness”).

  2021-Q1-2 – Improved Acoustic Performance

• 5dB SPL boost.

• Packaged chip plays out of the clean room.

• Multiple chips – 4 chips play together. 80 chips later this year.

  2021-Q3-4 – Improved Acoustic Performance

• Optimization through simulation – currently SPL >70dB @ 1m (additional 10-15dB SPL)

• Product Fabrication later this year

If I might also just point out that it is misinformation like your post that is likely to have contributed to a lot of holders being persuaded that the state of progress is way behind the actual status that has already been announced as being the case.

DYOR!