For any interested tech heads,
Telink Semiconductor Ble Mesh R&D department is currently working on version 2.0 Ble Mesh SDK to be compatible with bluetooth SIG mesh while retaining the technical advantages and features of the existing Mesh SDK. There are plans to release SDK 3.0 by the end of 2017. It will add precision positioning, long packet communications, long range single hop and other functions. Making it highly suitable for IOT product development.
IMO GLTAH.
For any interested tech heads, Telink Semiconductor Ble Mesh R&D...
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