Great pick-up Hudson! And plenty of insightful comments.
Just confirms to me that we have already had our 'big' announcement (i.e. the Telink collaboration) and the market does not quite understand that yet. If we get more 'big' ones all the better.
But here we are (via Telink) being introduced and demonstrated on the world stage. There is no doubt about that, based on this extract from Lenovo's press release on the event:
"Today at Tech World 2016,
Lenovo (HKSE: 0992) (PINK SHEETS: LNVGY) shared its vision for the future of smart, connected devices and unveiled new products that reshape what’s possible.......More than 1,300 people, including fans, media, industry influencers and analysts, joined Lenovo at the Masonic in Silicon Valley for the second annual global conference. Lenovo chairman and CEO Yuanqing Yang led the keynote ....... In addition to launching products, Intel CEO Brian Krzanich, Juniper Networks’ founder, vice chairman and CTO, Pradeep Sindhu and tech leaders from Google
shared their insights on the most promising and emerging topics in innovation, including IoT and smart connectivity, the power of big data and transformative user experiences. Through device innovation, device and cloud connectivity and building flexible, reliable and safe infrastructure, Lenovo will deliver the next generation of technology advancements".
http://www.businesswire.com/news/financialpost/20160609006152/en/Lenovo-Unveils-Smartphones-Reshape-What’s-Vision-Connected
I also very much liked the first paragraph of the section 'Concept Devices:Innovation Beyond 2016' in Lenovo's News Room release that you posted i.e:
"We also demonstrated several concept innovations that reflect the creativity, experimentation and ingenuity of our engineers, designers and developers around the world.
These concepts have the capability to shape the face of tomorrow’s technology".
These 'concept innovation' demonstrations included, as you point out and as included in the Lenovo news release,
Telink's soon to be ADRC-enabled chip.
It was also news to me that Telink is one of 'Lenovo’s startup investment companies'. On top of being one of Intel's 'portfolio companies'. Wow - talk about being well networked!
And, yes, the specific chip Telink demonstrated at Tech World was the 'first all-in-one system on a chip for the Internet of Things'. That is, the
TLSR8269F512.
When launched in Jan this year Dr Sheng had this to say about the TLSR8269F512:
Telink's proprietary BLE Mesh technology already is the leading solution for smart lighting, smart home and related applications and has been adopted by Tier One lighting customers in US and China. With the ability to integrate security, voice search, touch control and other factors, t
he TLSR8269 is an ideal single-chip solution for human interface devices ranging from smart home applications to wireless toys.
"The TLSR8269 concurrent multi-standard support is the culmination of years of R & D by Telink's leadership engineering team," said Dr. Wenjun Sheng, CEO of Telink Semiconductor. "
It will change the face of IoT, enabling end products to be built with a single chip that rules all standards."
Then, when Xped announced, on 17 May, that they had "commenced collaboration and development on a project to port Xped’s ADRC IoT Stack to Telink’s “TLSR8269F512” IoT chip", Dr Sheng said:
"Xped’s ADRC IoT Stack technology running on our IoT Chip
will provide a world beating combination for applications that require very low bill of materials cost. We believe that the
price/performance of these integrated technologies will be unmatched in the IoT market"
This, presumably, has been the message that Dr Sheng has been demonstrating to more than a thousand global tech leaders at San Francisco in recent days.
Looks like the news flow in the coming months is going to be.....well, amazing!
(20min delay)