What happened with tower?
there's obviously a reason specs haven't yet been released, can they state what the reason/s are?
it seems EM are chip only production. How is automation of chip packaging progressing? Same with coating.
how far are we from fully functioning completed chips rolling out of a factory and into customers hands to be used in their products? Ie sales
50 million chips is a great start, if demand is as great as it is anticipated to be, what is the plan to further scale up?
when are the demo boards anticipated to be shipped?
i don't expect anyone to ask the above, rather just posting some questions to think about and potentially put to the team if you think it's worth asking.
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