South Korea, Samsung, Hyundai + Neuromorphic Chips, page-421

Two very interesting patents:


https://patentscope.wipo.int/search/en/detail.jsf?docId=US322912657

US20210125045 - STACKED NEUROMORPHIC DEVICES AND NEUROMORPHIC COMPUTING SYSTEMS

Abstract
A stacked neuromorphic device includes a logic die including a control circuit and configured to communicate with a host, and core dies stacked on the logic die and connected to the logic die via through silicon vias (TSVs) extending through the core dies. The core dies include a neuromorphic core die including a synapse array connected to row lines and column lines. The synapse array includes synapses configured to store weights and perform a calculation based on the weights and input data. The weights are included in layers of a neural network system. And the control circuit provides the weights to the neuromorphic core die through the TSVs and controls data transmission by the neuromorphic core die.


https://patentscope.wipo.int/search/en/detail.jsf?docId=US322912660

US20210125048 - NEUROMORPHIC PACKAGE DEVICES AND NEUROMORPHIC COMPUTING SYSTEMS

Abstract
A neuromorphic package device includes a systolic array package and a controller. The systolic array package includes neuromorphic chips arranged in a systolic array along a first direction and a second direction. The controller communicates with a host controls the neuromorphic chips. Each of the neuromorphic chips sequentially transfers weights of a plurality layers of a neural network system in the first direction to store the weights. A first neuromorphic chip performs a calculation based on stored weights therein and an input data received in the second direction, and provides a result of the calculation to at least one of a second neuromorphic chip and a third neuromorphic chip which are adjacent to the first neuromorphic chip. The at least one of the second and third neuromorphic chips performs a calculation based on a provided result of the calculation and stored weights therein.